The complete ARRIX catalogue
10 approved entries across 1 families · every entry maps into the ArrixTecMall and quotes through the quotation builder.
Semiconductor & Electronics Materials
10 entries
Advanced Packaging Substrates, Leadframes, Interposers & Ceramics
Structural and interconnect materials for semiconductor packaging, module assembly and high-reliability electronics.
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CMP Slurries, Pads, Conditioners & Cleaning Materials
Chemical-mechanical planarization consumables and post-CMP cleaning materials for controlled removal, uniformity and defect performance.
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Compound Semiconductor Wafers: SiC, GaN, GaAs & InP
Compound-semiconductor substrates and epiwafers for power electronics, RF, photonics and advanced research applications.
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Deposition Precursors, Metals, Targets & Evaporation Materials
Thin-film deposition inputs for PVD, CVD, ALD, evaporation and related semiconductor or electronics processes.
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Dopants, Implant Sources & Specialty Semiconductor Materials
Dopant sources and specialty materials for diffusion, implantation, source/drain engineering and advanced device research.
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High-Purity Process Gases, Wet Chemicals & Solvents
Electronic-grade gases, acids, bases, solvents and cleaning chemicals for semiconductor and electronics manufacturing, supplied under strict purity, packaging and safety …
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PCB Laminates, Copper Foils, Critical Minerals & Strategic Materials
Electronic-material inputs and strategic sourcing support for printed circuits, magnets, batteries, semiconductors and other advanced electronics supply chains.
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Photomasks, Reticles, Photoresists & Lithography Consumables
Patterning materials and services used in semiconductor, MEMS, display and microfabrication lithography processes.
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Silicon, SOI & Epitaxial Wafers
Prime, test and specialty silicon wafer products, including silicon-on-insulator and epitaxial options, sourced to customer-defined technical and traceability requirement…
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Wire Bond, Solder, Die-Attach, Encapsulants & Thermal Materials
Semiconductor and electronics assembly materials for interconnection, attachment, protection and thermal management.
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