- OSATs and packaging houses
- Electronics manufacturers
- Module makers
- R&D teams
Catalogue › Semiconductor & Electronics Materials › Advanced Packaging Substrates, Leadframes, Interposers & Ceramics
Semiconductor & Electronics Materials
Advanced Packaging Substrates, Leadframes, Interposers & Ceramics
Structural and interconnect materials for semiconductor packaging, module assembly and high-reliability electronics.
- Qualified packaging material options
- Matched mechanical and electrical properties
- Traceable lots and drawings
- Support for prototype-to-production scale-up
- Organic package substrates
- Leadframes and stamped parts
- Silicon, glass and organic interposers
- Ceramic substrates and packages
- Lids, heat spreaders and carriers
- Custom drawings, surface finishes and inspection documentation
- Approved technical specification and quotation
- Qualified supplier/manufacturer record
- Certificate of Analysis and lot/heat/batch traceability
- Safety Data Sheet when applicable
- Origin, export/end-use and compliance documents
- Packaging, shipping, receiving and storage instructions
- Prototype panel or strip
- Engineering lot
- Production lot
- Custom tooling
- High-reliability material set
- Exact grade, purity and technical tolerances
- Quantity, minimum order and packaging
- Availability, qualification sample and lead time
- Incoterm, freight, hazmat and insurance
- Origin, export, end-use and compliance requirements
- Currency, price validity and payment risk
Content on this page comes from the governed ARRIX catalogue record MAT-08; pricing is confirmed only through a reviewed quotation.